一、期刊論文

1. H. T. Tung, I. G. Chen, I. M. Kempson, J. M. Song, Y. F. Liu, P. W. Chen, W. S. Hwang and Y. Hwu⁺, “Shape-controlled Synthesis of Silver Nanocrystals by X-ray Irradiation for Inkjet Printing” ACS Applied Materials and Interfaces, dx.doi.org/10.1021/am3015718 (IF: 4.525).

2. J. M. Song⁺, D. S. Wang, C. H. Yeh, W. C. Lu, Y. S. Tsou, and S. C. Lin, “Texture and Temperature Dependence on the Mechanical Characteristics of Copper Electrodeposits” Material Science and Engineering A, vol. 559, pp. 655-664, 2013. (IF: 2.003)

3. Y. L. Shen, S. Y. Chen, J. M. Song⁺, and I. G. Chen, “Ultra-long Pt Nanolawns Supported on TiO₂ Coated Carbon Fibers as 3D Hybridcatalyst for Methanol Oxidation” Nanoscale Research Letters, vo. 7, 237, 2012. (IF: 2.726)

4. Y. L. Shen, S. Y. Chen, J. M. Song⁺, and I. G. Chen, “Kinetic Study of Pt Nanocrystal Deposition on Ag Nanowires with Clean Surfaces via Galvanic Replacement” Nanoscale Research Letters, vol. 7, 245, 2012. (IF: 2.726)

5. J. M. Song⁺, Y. R. Liu, Y. S. Lai, Y. T. Chiu and N. C. Lee, “Influence of Trace Alloying Elements on the Ball Impact Test Reliability of SnAgCu solder joints” Microelectronics Reliability, vol. 52, pp. 180-189, 2012 (IF: 1.167)

6. J. M. Song⁺, B. R. Huang, C. Y. Liu, Y. S. Lai, Y. T. Chiu and T. W. Huang, “Nanomechanical Responses of Intermetallic Phase at the Solder Joint Interface - Crystal Orientation and Metallurgical Effects” Material Science and Engineering A, vol. 534, pp. 53-59, 2012. (IF: 2.003)

7. Y. L. Shen, S. Y. Chen, J. M. Song⁺, T. K. Chin, C. H. Lin and I. G. Chen, “Direct Growth of Ultra-long Platinum Nanolawns on a Semiconductor Photocatalyst” Nanoscale Research Letters, vol. 6, 380, 2011. (IF: 2.726)

8. H. T. Tung, Y. Hwa, I. G. Chen, M. G. Tsai, J. M. Song, I. M. Kempson and G. Margaritondo, “Fabrication of Single Crystal CuGaS₂ Nanorods by X-ray Irradiation” Chemical Communications vol. 47, pp. 9152-9154, 2011 (IF. 6.169)

9. J. M. Song⁺, Y. C. Chang-Chien, B. C. Huang, W. T. Chen, C. R. Shie and C. Y. Hsu, Spectroscopic Investigation of Oxidized Solder Surfaces, Corrosion Science, vol. 53, pp. 2283-2288, 2011. (SCI) (IF. 3.734)

10. J. M. Song⁺, G. D. Chiou, W. T. Chen, S. Y. Chen, T. H. Kao, I. G. Chen and H. Y. Lee, Observations on PVP-protected Noble Metallic Nanoparticle Deposits upon Heating via In Situ Synchrotron Radiation X-ray Diffraction, Physical Chemistry Chemical Physics, vol. 13, pp. 5099-5104, 2011. (SCI) (IF: 3.573) 該期刊March 2011 Top 10 most read paper

11. T.H. Kao, J.M. Song, I.G. Chen⁺, T.Y. Dong and W. S. Hwang, Nano-sized Induced Low Temperature Alloying in Binary and Ternary Noble Alloy Systems for Micro-interconnect Applications, Acta Materialia, vol. 59, pp. 1184-1190, 2011. (SCI) (IF: 3.781)

12. H. T. Tung, J. M. Song, S. W. Feng, C. Kuo and I. G. Chen+ “Dependence of Surface Atomic Arrangement of Titanium Dioxide on Metallic Nanowire Nucleation by Thermally Assisted Photoreduction” Physical Chemistry Chemical Physics, vol. 12, pp. 740-744, 2010. (SCI) (IF: 3.573)

13. J. M. Song+, C. W. Su, Y. S. Lai and Y. T. Chiu “Time Dependent Deformation Behavior of Interfacial Intermetallic Compound Layers in Electronic Solder Joints” Journal of Materials Research vol. 25, pp. 629-632, 2010. (SCI) (IF. 1.434)

14. J. M. Song⁺, C. H. Tsai, and Y. P. Fu “Electrochemical Corrosion Behaviour of Bi-11Ag Alloy for Electronic Packaging Applications” Corrosion Science, vol. 52, pp. 2519-2524, 2010. (SCI) (IF. 3.734)

15. C. Y. Liu⁺, H. W. Tseng, J. M. Song “Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure” Electrochemical and Solid State Letters vol. 13, pp. H298-H300, 2010. (SCI) (IF. 1.995)

16. T. Y. Dong⁺, C. N. Chen, C. W. Wang, W. T. Chen, C. P. Chen, S. F. Lin, S. Hsieh, C. W. Hsieh, J. M. Song, I. G. Chen, H. T. Tung and T. H. Kao “Constructions of Silver Nanowires and Copper Oxide Microrings by a Surface-formation Technique” Journal of Colloid and Interface Science vol. 343, pp. 7-17, 2010. (SCI) (IF. 3.07)

17. J. M. Song⁺, Y. M. Cheng and C. H. Tsai “Oxidation of Liquid Solders for Die Attachment” Corrosion Science, vol. 52, pp. 4011-4016, 2010. (SCI) (IF. 3.734)

18. T. H. Kao, J. M. Song, I. G. Chen+, T. Y. Dong, W. H. Hwang and H. Y. Lee, “Observations on the Melting of Au Nanoparticle Deposites and Alloying with Ni via In-situ Synchrotron Radiation X-ray Diffraction” Applied Physics Letters, vol. 95, 131905, 2009. (SCI) (IF: 3.844)

19. H. T. Tung, I. G. Chen+, J. M. Song and C. W. Yen, “Thermally-Assisted Photoreduction of Vertical Silver Nanowires” Journal of Materials Chemistry, vol. 19, pp. 2386-2391, 2009 (SCI) (IF: 5.968)

20. T. Y. Dong⁺, W. T. Chen, C. W. Wang, C. P. Chen, C. N. Chen, M. C. Lin, J. M. Song, I. G. Chen, and T. H. Kao, “One-step Synthesis of Uniform Silver Nanoparticles Capped by Saturated Decanoate: Direct Spray Printing Ink to Form Metallic Silver Film” Physical Chemistry Chemical Physics, vol. 11, pp. 6269-6275, 2009. (SCI) (IF: 3.573)

21. J. M. Song+, Y. H. Lin, C. W. Su and J. Y. Wang, “Mechanical Responses of Super-light b Based Mg-Li-Al-Zn Wrought Alloys under Resonance” Metallurgical and Materials Transactions A, vol. 40, pp. 1026-1030, 2009. (SCI) (IF. 1.545)

22. J. M. Song+ and H. Y. Chuang, “Faceting Behavior of Primary Ag in Bi-Ag Alloys for High Temperature Soldering Applications ” Materials Transactions, vol. 50, pp. 1902-1904, 2009. (SCI) (IF. 0.699)

23. L. W. Lin, J. M. Song+, Y. S. Lai, Y. T. Chiu, N. C. Lee and J. Y. Uan, “Alloying Modification of Sn-Ag-Cu Solders by Manganese and Titanium” Microelectronic Reliability, vol. 49, pp. 235-241, 2009. (SCI) (IF: 1.167)

24. J. M. Song+, Y. L. Shen, C. W. Su, Y. S. Lai and Y. T Chiu, “Strain rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates” Materials Transactions, . vol. 50, pp. 1231-1234, 2009. (SCI) (IF. 0.699)

25. T. Y. Dong+, H. H. Wu; C. Huang, J. M. Song, I. G. Chen, T. H. Kao “Octanethiolated Cu and Cu₂O Nanoparticles as Ink to Form Metallic Copper Film”, Applied Surface Science, vol. 255, pp. 3891-3896, 2009. (SCI) (IF. 2.103)

26. J. M. Song+, Y. R. Liu, C. W. Su, Y. S. Lai and Y. T. Chiu, “Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections” Journal of Materials Research, vol.23, pp.2545-2554, 2008. (SCI) (IF. 1.434)

27. H. T. Tung, J. M. Song, Y. T. Nien and I. G. Chen+, “A Novel Method for Preparing Vertically-grown Single Crystalline Gold Nanowire” Nanotechnology, vol. 19, 455603, 2008. (SCI). (IF: 3.979)

28. H. T. Tung, J. M. Song, T. Y. Dong, W. S. Hwang and I. G. Chen+, “Synthesis of Surfactant-free Aligned Single Crystal Copper Nanowire by Thermal-Assisted Photoreduction” Crystal Growth & Design, vol. 8, pp. 3415-3419, 2008.(SCI) (IF: 4.72)

29. Y. S. Lai+, J. M. Song, H.C. Chang and Y. T. Chiu: “Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints” Journal of Electronic Materials, vol. 37, pp. 201-209, 2008. (SCI) (IF. 1.466)

30. J. M. Song+, Y. L. Shen and H. Y. Chuang: “Sedimentation of Cu-rich Intermetallics in Liquid Lead-free Solders” Journal of Materials Research, vol.22, pp.3432-3439, 2007. (SCI) (IF. 1.434)

31. J. M. Song+, Z. M. Wu, D. A. Huang and H. Y. Chuang: “The Effect of Low Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solder” Journal of Electronic Materials, vol. 36, pp. 1608-1614, 2007. (SCI) (IF. 1.466)

32. J. M. Song+, H. Y. Chuang and Z. M. Wu: “Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High Temperature Soldering Applications” Journal of Electronic Materials, vol. 36, pp. 1516-1523, 2007 (SCI) (IF. 1.466)

33. T. H. Kao, J. M. Song, I. G. Chen+, T. Y. Dong and W. S. Hwang: “Interdiffusion Behavior at the Interfaces between Deposits of Au Nanoparticles and Electronic Substrates” Nanotechnology, vol. 18, 435708, 2007 (SCI) (IF: 3.979)

34. J. M. Song+, J. J. Lin, C. F. Huang and H. Y. Chuang: “Crystallization, Morphology and Distribution of Ag₃Sn in Sn-Ag-Cu alloys and Their Influence on Vibration Properties” Materials Science and Engineering A, vol. 466, pp. 9-17, 2007. (SCI) (IF. 2.003)

35. J. M. Song+, H. Y. Chuang and T. X. Wen: “Thermal and Tensile properties of Bi-Ag Alloy” Metallurgical and Materials Transactions A, vol. 38, pp. 1371-1375, 2007. (SCI) (IF. 1.545)

36. J. M. Song+, T. X. Wen and J. Y. Wang: “Vibration Fracture Properties of a Light Weight Mg-Li-Zn Alloy” Scripta Materialia, vol. 56, pp. 529-532, 2007. (SCI) (IF. 2.699)

37. J. M. Song+, T. Y. Lin and H. Y. Chuang: Microstructural Characteristics and Vibration Fracture Properties of Al-Mg-Si Alloys with Excess Cu and Ni, Materials Transactions, vol. 48, pp. 854-659, 2007. (SCI) (IF. 0.699)

38. J. M. Song+, Z. M. Wu and D. A. Huang: “Two Stage Nonequilibrium Eutectic Transformation in a Sn-3.5Ag-3In Solder” Scripta Materialia, vol. 56, pp. 413-416, 2007. (SCI) (IF. 2.699)

39. J. M. Song+, C. F. Huang and H. Y. Chuang: “Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM=Co, Ni and Zn) Alloys” Journal of Electronic Materials, vol. 35, pp. 2154-2163, 2006. (SCI)

40. J. M. Song+, H. Y. Chuang and Z. M. Wu: “Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates” Journal of Electronic Materials, vol. 35, pp. 1041-1049, 2006. (SCI)

41. P. Y. Yeh, J. M. Song+ and K. L. Lin: “Dissolution Behavior of Cu and Ag Substrates in Molten Solders” Journal of Electronic Materials, vol. 35, pp. 978-987, 2006. (SCI)

42. J. M. Song+, T. S. Lui, Y. L. Chang and L. H. Chen: “Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders” Journal of Electronic Materials, vol. 35, pp. 929-936, 2006. (SCI)

43. J. M. Song+ and Z. M. Wu: “Variable Eutectic Temperature Caused by Inhomogeneous Solute Distribution in Sn-Zn System” Scripta Materialia, vol. 54 pp. 1479-1483, 2006. (SCI)

44. T. H. Kao, J. M. Song+, I. G. Chen, H. H. Wu and T. Y. Dong: “Continuity and Adhesion of Gold Deposits on Electronic substrates by utilizing nanoparticle suspensions” Nanotechnology, vol. 17, pp. 1416-1420, 2006. (SCI) (IF: 3.137)

45. J. M. Song+, T. S. Lui, H. W. Chang and L. H. Chen: “The Influence of Al Content and Annealing on Vibration Fracture Properties of Wrought Mg-Al-Zn Alloys” Scripta Materialia, vol. 54, pp. 399-404, 2006. (SCI)

46. J. M. Song+, T. S. Lui, Y. L. Chang and L. H. Chen: “Compositional Effects on the Microstructure and Vibration Fracture Properties of Sn-Zn-Bi alloys” Journal of Alloys and Compounds, vol. 403, pp. 191-196, 2005. (SCI)

47. J. M. Song+, P. C. Liu, C. L. Shih and K. L. Lin: “Role of Ag in the Formation of Interfacial Intermetallic Phases in Sn-Zn Soldering” Journal of Electronic Materials, vol. 34, pp. 1249-1254, 2005. (SCI)

48. J. M. Song+, T. S. Lui, Y. L. Chang and L. H. Chen: “Tin Whiskers of Bulk Solders Generated under Resonance” Journal of Materials Research, vol. 20, pp. 1385-1388, 2005. (SCI)

49. J. M. Song+, T. S. Lui, I. H. Kao, L. H. Chen and H. M. Lin: “Effect of Microstructural Refinement on Tensile Behavior of the AC9A Aluminum Alloy Suffering Thermal Shock Fatigue” Scripta Materialia, vol. 51, pp. 1159-1163, 2004. (SCI)

50. J. M. Song+, T. S. Lui, J. H. Horng, L. H. Chen and T. F. Chen: “Vibration Behavior of a Precipitation-hardening Aluminum Alloy under Resonance” Scripta Materialia, vol. 51, pp. 1153-1157, 2004. (SCI)

51. J. M. Song, T. S. Lui+, G. F. Lan, and L. H. Chen: “Microstructural Characteristics and Vibration Fracture Behavior of Sn-Zn-Ag Solder Alloys” Journal of Alloys and Compounds, vol. 379/1-2, pp. 233-239, 2004. (SCI)

52. J. M. Song and K. L. Lin+: “Double Peritectic Behavior of Ag-Zn Intermetallics in Sn-Zn-Ag Solder Alloys” Journal of Materials Research, vol. 19, pp. 2719-2724, 2004. (SCI)

53. J. M. Song+, F. I. Li, T. S. Lui and L. H. Chen: “Investigation of Vibration Fracture Behavior of Sn-Ag-Cu Solders under Resonance” Journal of Materials Research, vol. 19, pp. 2665-2673, 2004. (SCI)

54. J. M. Song, S. C. Lin, T. S. Lui+ and L. H. Chen: “Effects of Matrix Structure on the Resonant Vibration Behaviors of Spheroid Graphite Cast Iron” Materials Transactions, vol. 45, pp. 1379-1382, 2004. (SCI)

55. J. M. Song, N. S. Liu and K. L. Lin+: “Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys” Materials Transactions, vol. 45, pp. 776-782, 2004. (SCI)

56. J. M. Song+, Y. L. Chang, T. S. Lui and L. H. Chen: “Vibration Fracture Behavior of Sn-Bi Solder Alloys with Various Bi Contents” Materials Transactions, vol. 45, pp. 666-672, 2004. (SCI)

57. J. M. Song+, B. H. Tan, T. S. Lui and L. H. Chen: “Resonant Vibration Behavior of an Al-3.8Cu-0.8Li-0.3Mg Alloy” Metallurgical and Materials Transactions A, vol. 35A, pp. 952-957, 2004. (SCI)

58. J. M. Song+, T. S. Lui, L. H. Chen and D. Y. Tsai: “Resonant Vibration Behavior of Lead-free Solders” Journal of Electronic Materials, vol. 32, pp. 1501-1508, 2003. (SCI)

59. J. M. Song+ and K. L. Lin: “Behavior of Intermetallics in Liquid Sn-Zn-Ag Solder Alloys” Journal of Materials Research. vol. 18, pp. 2060-2067., 2003. (SCI)

60. Y. H. Song, T. S. Lui+, L. H. Chen and J. M. Song: “Study on the Vibration Fracture Resistance of Ferritic Spheroidal Graphite Cast Iron suffer from Aqueous Ambient Environments” Materials Transactions, vol. 44, pp. 1461-1468, 2003. (SCI)

61. J. M. Song, L. H. Chen and T. S. Lui+: “Examination on the Growth Textures of Eutectic Cementite of Various Morphologies” Material Science and Engineering A, vol. 374, no. 1-2, pp. 5-8, 2003. (SCI)

62. J. M. Song+, G. F. Lan, T. S. Lui and L. H. Chen: “Microstructure and Tensile Properties of Sn-Zn-Ag Lead Free Solder Alloys” Scripta Materialia, vol. 48, pp. 1047-1051, 2003. (SCI)

63. S. C. Lin, T. S. Lui+, L. H. Chen and J. M. Song: “Roles of Matrix Structure on Resonant Vibration Fatigue Fracture of Spheroidal Graphite Cast Iron” International Journal of Cast Metals Research, vol. 15, pp. 75-84, 2002. (SCI)

64. S. C. Lin, T. S. Lui, L. H. Chen and J. M. Song+: “Effect of Pearlite on Vibration Fracture Behavior of Spheroid Graphite Cast Irons under Resonant Condition” Metallurgical and Materials Transactions A, vol. 33A, pp. 2623-2634, 2002.(SCI)

65. D. C. Tsai, J. M. Song, T. S. Lui+ and L. H. Chen: “Studies on the Materials Removal Rate of Heterogeneous Two-phase Eutectic Alloys by EDM Process” International Journal of Cast Metals Research vol. 15, no. 1, pp. 61-66, 2002. (SCI).

66. D. C. Tsai, J. M. Song+, T. S. Lui and L. H. Chen: “A Study on Electro-discharge Machined Surfaces of Ferritic SG Cast Irons” Materials Transactions, vol. 43, pp. 1360-1366, 2002. (SCI)

67. J. M. Song+, L. H. Chen, T. S. Lui, Z. S. Tsai and J. D. Du: “Characterisation of Through-thickness Microstructure in Centrifugally Cast Hypereutectic Al-Si and Al-Al₃Ni Alloys” International Journal of Cast Metals Research, vol. 15, no. 1, pp. 55-60, 2002. (SCI)

68. J. M. Song+, T. S. Lui and L. H. Chen: “A Study on Inhomogeneous Distribution of Temper Graphite Particles in Strip-Cast Fe-C-Si Alloys” Metallurgical and Materials Transactions A., vol. 33, pp. 1263-1273, 2002. (SCI)

69. J. M. Song, T. S. Lui+ and L. H. Chen: “Tensile Embrittlement of High Silicon Cast Iron Strips Produced by Strip Casting Process” AFS Transactions, vol. 110, pp. 953-964, 2002 (EI)

70. F. T. Shiao, T. S. Lui+, L. H. Chen, J. M. Song: “The Relationship between Inclusion Clusting and Embrittlement of Ferrite Spheroidal Graphite Cast Iron at Intermediate Low Temperatures”, International Journal Cast Metals Research, vol. 14, pp. 137-145, 2001. (SCI)

71. J. M. Song, T. S. Chou, L. H. Chen and T. S. Lui+: “Texture Examination on Strip-Cast Fe-C-Si White Cast Iron”, Scripta Materialia, vol.44, pp. 1125-1130, 2001. (SCI)

72. J. M. Song, B. C. Kuo, T. S. Lui+ and L. H. Chen: The Effect of Rolling on Graphitization Characteristics of Strip Cast Fe-C-Si White Cast Iron”, Metallurgical and Materials Trans. A, vol. 31A, pp. 275-281, 2000. (SCI)

73. J. M. Song, T. S. Lui+ and L. H. Chen: “Effect of Carbon Equivalent and Spheroidizer Addition on the Morphology of Strip Cast White Cast Iron Plate”, International Journal of Cast Metals Research, vol. 12, pp. 83-91, 1999. (SCI)

74. J. M. Song, Y. W. Chao, T. S. Lui+ and L. H. Chen: “Rapidly Solidified Structure and Graphitization Characteristics of High Silicon Cast Iron Strip Produced by Strip Casting Process”, AFS Trans., vol. 105, pp. 491-496, 1997. (EI)

二、國內期刊

1. 高子軒，宋振銘，陳引幹，董騰元，黃文星：應用於下世代微電子連接點線之奈米金屬粒子相變態行為研究，興大工程學刊，第21卷第2期，72-80頁，民國99年。

2. 蔡齊航、宋振銘、傅彥培：高溫無鉛銲料在3.5%NaCl溶液之電化學腐蝕行為，防蝕工程，第24卷第2期，193-200頁，民國99年。

3. 李祥宇、蔡齊航、宋振銘、吳慶成：加熱溫度對Bi-Ag/Bi₂Te₃熱電接點組織影響，金屬熱處理，106期，12-16頁，民國99年。

4. 林逸華、宋振銘、王建義：Mg-Li-Al-Zn合金振動破壞性質探討，鎂合金產業通訊，40期，49-56頁，民國97年。

5. 溫天相、黃啟峰、宋振銘、王建義：Mg-6Li-1Zn合金板材振動破壞行為探討，鎂合金產業通訊，36期，44-48頁，民國96年。

6. 高子軒、宋振銘、陳引幹、吳恒璽、董騰元：以奈米金懸浮液製備導電薄膜之研究，真空科技，第19卷第1期，47-53頁，民國95年。

7. 宋振銘、莊鑫毅、吳宗謀、李國瑋：新型LED晶片接合無鉛銲料開發，真空科技，第18卷第4期，8-14頁，民國95年。

8. 林光隆、宋振銘、黃家緯：Sn-Zn系無鉛銲錫合金與基材界面金屬間化合物生成之探討，界面科學會誌，第26卷第2期，第61-69頁(民國93年)。

9. 林光隆、宋振銘：Sn-Zn系列無鉛銲錫合金研究現況，材料會訊，第10卷第1期，第21-33頁(民國92年)。

10. 宋振銘、蔡德昌、呂傳盛、陳立輝：球墨鑄鐵放電表面改質層形態及微觀組織解析，鑄工季刊，第113期，第21-28頁(民國90年)。

11. 宋振銘、呂傳盛、陳立輝：薄板連鑄白口鑄鐵石墨化處理研究，金屬熱處理，第64期，第49-57頁(民國89年)

三、國際研討會論文

1. J. M. Song, T. S. Lui and L. H. Chen: “Microstructure And Crystallographic Texture of Strip-Cast Fe-C-Si Alloys”, International Conference on Solidification Science and Processing, Bangalore, India, Feb 18-21, 2001.

2. S. L. Kuan, T. S. Lui, L. H. Chen and J. M. Song: “A Study on The Structural Characteristics and Tensile Properties of Al-Si Alloys Utilizing Strip Casting Method”, The Second International Conference on Light Materials for Transportation Systems, Pusan, Korea, May 6-10, 2001.

3. J. M. Song, Z. S. Tsai, T. S. Lui and L. H. Chen: “Fabrication of Light-weight Pipes with Functionally Gradient Material”, The Fourth Pacific International Conference on Aerospace Science and Technology, Kaohsiung, Taiwan, May 21-23, 2001, pp. 397-400.

4. H. J. Tzeng, J. M. Song, T. S. Lui and L. H. Chen: “A Study on Tensile Deformation Behavior of Commercial Mg-3Al-1Zn-0.5Mn Alloy at Elevated Temperatures”, The Fourth Pacific International Conference on Aerospace Science and Technology, Kaohsiung, Taiwan, May 21-23, 2001, pp. 401-403

5. Z. S. Tsai, J. D. Du, J. M. Song, L. H. Chen and T. S. Lui: “Solidification Structure of Two-phase Eutectic Aluminum Functionally Gradient Materials by the Centrifugal Casting Method”, Proceedings of the Seventh Asian Foundry Congress, Taipei, Taiwan, Oct. 12-15, 2001, pp. 469-476

6. J. M. Song, G. F. Lan, T. S. Lui and L. H. Chen: “Microstructural Features and Vibration Fracture Behavior of Sn-Zn-Ag Solder Alloys”, The 4th International Symposium on Electronic Materials and Packaging (EMAP 2002), Kaohsiung, Taiwan, Dec. 3-6, 2002.

7. J. M. Song, T. S. Lui, L. H. Chen and T. Y. Tsai: “Resonant Vibration Behavior of Lead-free Solders”, TMS Annual Meeting, San Diego, March 2-6, 2003. (invited)

8. F. I. Li, J. M. Song, T. S. Lui and L. H. Chen: “Effects of Copper Content on Vibration Fracture Behavior of Sn-Ag-Cu Solders”, TMS Annual Meeting, San Diego, March 2-6, 2003.

9. J. M. Song, P. Y. Yeh and K. L. Lin: “Dissolution of Cu and Ag Substrates by Molten Lead-free Solders”, The 5^th International Symposium on Electronic Materials and Packaging (EMAP 2003), Singapore, Nov. 17-20, 2003.

10. K. L. Lin, P. C. Liu, and J. M. Song: “Wetting Interaction between Pb-free Sn-Zn Series Solders and Cu, Ag Substrates”, The 54^th ECTC, Las Vegas, June 1-4, 2004.

11. J. M. Song, N. S. Lui, P. C. Liu and K. L. Lin: “Effects of Ga additions on the Microstructure and Properties of Sn-Zn-Ga Solder Alloys”, TMS Annual Meeting, Charlotte, March 15-17, 2004.

12. J. M. Song, T. Y. Tsai, T. S. Lui and L. H. Chen: “Behavior of Eutectic Sn-Zn, Sn-Ag and Sn-Pb Solders under High Current Stressing Conditions”, TMS Annual Meeting, Charlotte, March 15-17, 2004.

13. J. M. Song, T. S. Lui, Y. L. Chang and L. H. Chen: “Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders”, TMS Annual Meeting, San Francisco, Feb. 14-16, 2005.

14. P. Y. Yeh, J. M. Song and K. L. Lin: “Dissolution Behavior of Cu and Ag Substrates in Molten Solders” TMS Annual Meeting, San Francisco, Feb. 14-16, 2005.

15. J. M. Song, T. S. Lui and L. H. Chen: “A Study on Vibration Induced Deformation Structure of Sn-based Pb-free Solders”, IMAPS TAIWAN 2005, Taipei, April 22-25, 2005.

16. J. M. Song, Y. L. Shen and H. Y. Chuang: “Sedimentation of Intermetallics in Liquid Lead-free Solders” TMS Annual Meeting, San Antonio, March 12-16, 2006.

17. T. H. Kao, J. M. Song, I. G. Chen, H. H. Wu and T. Y. Dong: “Deposition of Conductive Films on Electronic Substrates by Using Gold Nanopowders” TMS Annual Meeting, San Antonio, March 12-16, 2006.

18. T. H. Kao, J. M. Song, I. G. Chen, H. H. Wu and T. Y. Dong: “Properties of Au Deposits on Electronic Substrates by Utilizing Nanoparticle Suspensions” Nanotechnology in Northern Europe 2006 Congress, Helsinki, Finland, May 16-18, 2006.

19. H. Y. Chuang and J. M. Song: Interfacial Behaviour between Bi-Ag based Solders and Ni substrate, IMAPS TAIWAN 2006, Taipei, June 28-July 1, 2006.

20. Z. M. Wu, T. X. Wen and J. M. Song: Tensile properties of Bi-Ag new Pb-free die attach solder and the joints, IMAPS TAIWAN 2006, Taipei, June 28-July 1, 2006.

21. J. M. Song, K. K. Lew and H. Y. Chuang: Electrical resistivity and interfacial behavior of Bi-Ag/Cu high temperature solder joints, TMS Annual Meeting, Orlando, Feb 25-March 1, 2007.

22. J. M. Song and Z. M. Wu: Mechanical properties of Bi-Ag Pb-free die attach solder joints, TMS Annual Meeting, Orlando, Feb 25-March 1, 2007.

23. H. T. Tung, J. M. Song, I. G. Chen: Fabrication of thermal reduced metallic nano-wires on titanium dioxide, E-MRS meeting, Strasbourg, May 28-June 1, 2007.

24. J. M. Song, T. H. Kao, I. G. Chen, T. Y. Dong: Nano-sized Induced Low Temperature Alloying Behaviour in Interconnection Applications, ISMEN, Tainan, Sep. 3-5, 2008.

25. H. Y. Chuang and J. M. Song: Interfacial Behavior between Bi-Ag Solders and the Ni Substrate, TMS Annual Meeting, New Orleans, March 9-13, 2008.

26. L. W. Lin, J. M. Song, Y. S. Lai, Y. T. Chiu and Ni. C. Lee: Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance, IMPACT/EMAP, Taipei, Oct. 22-24, 2008.

27. Y. L. Shen, J. M. Song and C. W. Su: Nanoindentation analysis of interfacial IMCs in electronic solder joints, IMPACT/EMAP, Taipei, Oct. 22-24, 2008.

28. G. W. Lee, J. M. Song, Y. S. Lai, Y. T. Chiu and C. W. Su: Size and substrate effects on microstructure and shear properties of solder joints, IMPACT/EMAP, Taipei, Oct. 22-24, 2008.

29. Y. R. Liu, J. M. Song, Y. S. Lai Y. T. Chiu and W. T. Chen: Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections, IMPACT/EMAP, Taipei, Oct. 22-24, 2008.

30. Y. S. Lai, and J. M. Song^:Electromigration Reliability with Respect to Cu Content in Solder Joint System, EPTC, Singapore, Dec. 9-12, 2008.

31. J. M. Song, L. W. Lin, N. C. Lee, Y. S. Lai and Y. T. Chiu: Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders, EPTC, Singapore, Dec. 9-12, 2008.

32. J. M. Song, G. W. Lee, C. Y. Liu, Y. S. Lai and Y. T. Chiu: Size and substrate effects on the mechanical properties of solder joints, TMS Annual Meeting, San Francisco, Feb. 15-19, 2009.

33. T. H. Kao, J. M. Song, I. G. Chen, W. S. Hwang, T. Y. Dong: Nano-sized Induced Low Temperature Alloying Behaviour in Interconnection Applications, TMS Annual Meeting, San Francisco, Feb. 15-19, 2009.

34. T. H. Kao, J. M. Song, I. G. Chen, T. Y. Dong and W. H. Hwang: Physical Properties of Metalic Nanoparticle Deposits for the Electrodes of Flexible Electronics, E-MRS meeting, Strasbourg, June 8-12, 2009.

35. C. H. Tsai and J. M. Song: Electrochemical corrosion behavior of Pb-free solders for die attachment, IMPACT/EMAP, Taipei, Oct. 21-23, 2009.

36. C. W. Su, J. M. Song, B. R. Huang, Y. S. Lai and Y. T. Chiu: Time dependent plastic deformation behavior of interfacial intermetallic compounds in solder joints, IMPACT/EMAP, Taipei, Oct. 21-23, 2009.

37. Y. R. Liu1, J. M. Song, Y. S. Lai and Y. T. Chiu: Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints, IMPACT/EMAP, Taipei, Oct. 21-23, 2009.

38. T. H. Kao, J. M. Song, J. Y. Wang, and I. G. Chen “Phase Transformation of Metallic Nanoparticle Deposits for the Electrodes of Flexible Electronics” ICSJ2010, Tokyo, August 24-26, 2010

39. D. S. Wang, J. M. Song and S. C. Lin: Mechanical properties of electrodeposited copper foils for PCB applications, IMPACT, Taipei, October 20-22, 2010.

40. Y. C. Chang-Chien, J. M. Song, B. C. Huang, W. T. Chen, C. R. Shie and C. Y. Hsu: Oxidation properties of Sn-Cu-Ni solders with minor alloying additions, IMPACT, Taipei, October 20-22, 2010.

41. C. H. Tsai, Y. M. Cheng and J. M. Song: Electrochemical corrosion and oxidation behaviors of high temperature Pb-free solders, IMPACT, Taipei, October 20-22, 2010.

42. C. H. Tsai and J. M. Song, “Electrochemical corrosion behavior of high temperature Pb-free solders”, TMS Annual Meeting, Seattle. WA, February 14-18, 2010.

43. Y. R. Liu, J. M. Song, Y. S. Lai, Y. T. Chiu, “Effect of Minor Alloying on the Performance of Snagcu Solder Joints under Ball Impact Test”, TMS Annual Meeting, Seattle. WA, February 14-18, 2010.

44. Y. L. Shen, C. W. Su, J. M. Song, S. Y. Chen, “Mechanical properties of Interfical IMCs in solder joints evaluated by Nanoindentation”, TMS Annual Meeting, Seattle. WA, February 14-18, 2010.

45. T. H. Kao, J. M. Song, I. G. Chen, T. Y. Dong, W. S. Hwang, “Observations on the Melting of Metallic Nanoparticle Deposites via In-situ Synchrotron Radiation X-ray Diffraction”, TMS Annual Meeting, Seattle. WA, February 14-18, 2010.

46. J. M. Song, G. D. Chiou, W. T. Chen, S. Y. Chen, T. H. Kao, I. G. Chen and H. Y. Lee, “Phase Transformation of PVP-protected Noble Metallic Nanoparticle Deposits upon Heating in Air” TMS Annual Meeting, San Diego CA, Feb. 27-March 3, 2011 (Invited talk).

47. Y. L. Shen, S. Y. Chen, J. M. Song, T. K. Chin, C. H. Lin, and I. G. Chen, “Synthesis of Vertical Ultra-long Platinum Nanolawns via Thermally Assisted Photoreduction” TMS Annual Meeting, San Diego CA, Feb. 27-March 3, 2011.

48. C. H. Tsai, Y. M. Cheng and J. M. Song, “Oxidation behaviors and cosmetic discolor of Pb-free solders” TMS Annual Meeting, San Diego CA, Feb. 27-March 3, 2011.

49. J. M. Song, J. J. Lin and D. S. Wang, Mechanical Reliability of Die Attach Joints for Power Devices, InterPACK, Portland, July 6-8 2011

50. J. M. Song, G. D. Chiou, S. Y. Chen, and H. Y. Lee, Phase Transformation of Nanoparticle Deposits for Micro-interconnect Applications, ICMAT 2011, Singapore, June 26-July 1 2011.

51. J. M. Song, Y. L. Shen, S. Y. Chen and I. G. Chen, Surfactant- and Template-less Synthesis of Ultra-long Pt Nanowires, ECO-MATES 2011, Osaka Japan, Nov. 28-30, 2011.

52. J. M. Song, C. H. Chang, J. S. Wu, C. H. Tsai and S. Y. Chen, Cu to Cu Bonding with Cu@Ag Core-shell Nanoparticles” LTB-3D 2012, Tokyo, May 22-23, 2012.

53. I. G. Chen, W. S. Hwang, T. Y. Dong, L. C. Hsu, C. Kuo, and J. M. Song, “Metallic Nanoparticle Dispersions for Interconnect on Flexible Substrate by Ink-Jet Printing, ISMEN 2012, LA, August 27-29 2012 (Invited talk)

54. C. H. Tsai, J. M. Song, S. Y. Chen, I. G. Chen and H. Y. Lee, “In-situ Observation of Cu@Ag Core-shell Nanoparticles upon Heating” IMPACT 2012, October 23-25 2012

55. M. J. Lin, J. M. Song, Y. S. Lai and Y. T. Chiu, “Ball Impact Test Reliability of Solder Joints for Power Devices” IMPACT 2012, October 23-25 2012

56. Y. S. Zou, J. M. Song, and S. C. Lin, “Electrochemical Corrosion Properties of Electrodeposited Cu Foils” IMPACT 2012, October 23-25 2012

四、國內會議

1. 劉耀仁、宋振銘、邱盈達、賴逸少：多次迴銲處理對添加過渡金屬元素Sn-Ag-Cu BGA錫球接點組織影響，熱處理年會(民國96年)。

2. 林逸華、宋振銘、王建義：退火處理對輕量化Mg-Li合金振動破壞性質影響探討，熱處理年會(民國96年)。

3. 莊鑫毅、宋振銘：Interfacial Behaviour between Bi-Ag Solders and the Ni substrate，材料年會。

4. 莊鑫毅、陳位同、宋振銘：應用於晶片構裝Bi-Ag合金凝固組織特徵探討材料年會(民國96年)

5. 吳宗謀、宋振銘：Bi-Ag/Ni銲點接合性質探討，材料年會(民國96年)。

6. 吳宗謀、宋振銘、黃德安、莊鑫毅：The Effect of Low Temperature Solute Elements on Solidification Structure of Sn-Ag Solders，材料年　　　　會(民國96年)。

7. 林立偉、宋振銘：Mn添加對SnAgCu銲料微觀組織及振動破壞特性影響材料年會(民國96年)

8. 沈佑霖、宋振銘、莊鑫毅：Sedimentation of Cu-rich intermetallics in liquid Sn-Zn solders，材料年會(民國96年)。

9. 林逸華、宋振銘、王建義：高Li含量Mg-Li-Al-Zn合金振動破壞性質高Li含量Mg-Li-Al-Zn合金振動破壞性質，材料年會(民國96年)。

10. 鄭昀閩、宋振銘：電子構裝用高溫銲料液態氧化行為，材料年會(民國96年)。

11. 高子軒，宋振銘，陳引幹，董騰元，黃文星；奈米金屬粒子低溫合金化行為之研究，熱處理年會(民國97年).

12. 李國瑋，宋振銘：微電子銲點組織與機性之尺寸微小化及基材差異效應探討，材料年會(民國97年)。

13. 鄧乃元，宋振銘：過共晶Bi-Ag合金拉伸特性研究，材料年會(民國97年)。

14. 黃伯彰，徐福聲，宋振銘：合金系統與基材對BGA無鉛銲點摔落可靠度影響研究，材料年會，(民國97年)。

15. 沈佑霖，宋振銘，蘇建偉：Strain rate dependence on mechanical behavior of interfacial IMCs in electronic solder joints，材料年會，(民　國97年)。

16. 林立偉，宋振銘，賴逸少，邱盈達，李寧成，汪俊延：Alloying design of Pb-free solders for improving drop impact resistance，材料年會，(民國97年)。

17. 劉耀仁，宋振銘，賴逸少，邱盈達，陳韋廷：Alloying modification for suppressing Ni-Sn-P formation in SAC/Ni-P joints，材料年會，(民　　　國97年)。

18. 曾傳政，林立偉，宋振銘：高制振銲錫合金振動變形行為特性探討，材料年會，(民國97年)。

19. 羅新傑，陳韋廷，宋振銘，賴逸少，邱盈達：Ni添加對BGA無鉛銲點組織與摔落測試影響之探討，材料年會，(民國98年)。

20. 葉忠憲，宋振銘，林士晴：不同添加劑之商業用電鑄銅箔機械性質探討，材料年會，(民國98年)

21. 劉耀仁，宋振銘，賴逸少，邱盈達：Sn-Ag-Cu銲料合金改質對介面生成物與球衝擊可靠度之影響，材料年會，(民國98年)

　　　　蘇建偉，宋振銘，黃柏融，賴逸少，邱盈達：Nanoindentation creep behavior of interfacial